Science

Made through real -time laser material detection enhancement accuracy

Scientists at the University of Connecticut have made significant breakthroughs in the precise manufacturing industry. It designed a technology that automatically real -time material testing during ultra -short pulse laser processing. This breakthrough is published on PLOS One, using laser -induced collapse spectrum (libs) to enhance the process adjustment, endpoint and segmentation in laser processing applications.

The research team led by Dr. Pouya Tavousi and Dr. HONGBIN Choi, Dr. Adrian Phoulady, Dr. Pouria Hoveida, Dr. Nicholas May and Sina SHAHBAZMOHAMADI proposed a systematic system that integrates LIBS into the laser processing work. Allow real -time detection and decision -making. This method solves the limitations of traditional methods, such as X -ray diffraction (XRD) and energy decentralized X -ray spectrum (EDS), which usually needs to interrupt sample transfer and inspection.

Dr. Tavousi of Connecticut University emphasizes the importance of this innovation: “Our method uses lib in the feedback circulation system, thereby realizing real -time adjustment of the laser process. This progress reduces processing time and increases material testing Accuracy, no need to transfer the sample to the separate instrument. “

Ultrashort pulse laser is known for its accuracy in micro -processing, but according to the processed materials, they need to be carefully adjusted. The LIBS system developed by the researchers can achieve on -site portrait, thereby providing direct feedback to optimizing laser parameters in real time. This is particularly beneficial for complex samples (such as printing circuit boards), and different materials are different from laser.

One of the key benefits of this system is its ability to automate the endpoint. By analyzing the libs signal generated during the interaction of laser materials, the system can determine when to reach specific materials and automatically stop the process. This function is important for the application that requires accurate in -depth control, such as the manufacture of microelectronics and biomedical devices.

Researchers have proved the effectiveness of their methods through various examples. In an experiment, they created a sample with four different materials (silicon, aluminum, titanium, and copper), and used the libs system to detect each material in real time. The system successfully identified the material and adjusted the laser process accordingly, showing the potential of its automated material division and endpoint.

Dr. Tavousi emphasizes the wider meaning of this technology: “The ability to integrate LIBS into the laser processing platform can not only enhance the process automation, but also greatly reduce the demand for image processing after experience. This can simplify accuracy and efficiency until Operations in important industries “” “” “” “” “

The study also explored the space map of using LIB to create materials. By matching the spatial coordinate of the Libs signal with the time recorded with the laser path, the researchers generate a detailed material diagram without postponing the image segmentation. This function is proved on the printing circuit board. On this circuit board, the system supports LIBS accurately identify and maps the copper marks and the substrate of the dielectric composite material.

All in all, the integration of LIB and ultra -short pulse laser processing represents major progress of precise manufacturing. The automatic real -time material detection system developed by Dr. Tavousi and its team is expected to improve the efficiency, accuracy and automation of the laser processing process, and pave the way for the innovation of various high -precision industries.

Journal reference

Choi, H., Phoulady, A., Hoveida, P., May, N., Shahbazmohamadi, S. , & Tavousi, P. P. (2024). Use laser -induced decomposition spectrum to perform process adjustments, terminal surveys and segmentation, and automatically detect the real -time material detection during ultra -short pulse laser processing. Plos One, 19 (1), E0290761. DOI:

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